Innovation Platform Lead - Director / Senior Manager 创新平台负责人-experienced in semiconductor industry
Renesas Electronics
Join Renesas as an Innovation Platform Lead, engaging with innovation ecosystems and partners in the semiconductor industry. Drive strategic insights and scalable business opportunities in a diverse and inclusive environment.
Digital Product Manager
Blue Wireless
Join Blue Wireless as a Digital Product Manager to lead the development of FLOW, a next-generation digital platform enhancing customer interactions with connectivity services. Be part of our transformative journey!
Innovation Platform Lead - Director / Senior Manager 创新平台负责人-experienced in semiconductor industry
Renesas Electronics
Join Renesas as an Innovation Platform Lead, engaging with innovation ecosystems and supporting scalable business opportunities in the semiconductor industry. A Master's degree and 8+ years of experience are required.
Sr. Product Manager (E-commerce/Marketplace)
Binance
Join Binance as a Sr. Product Manager to develop product strategies for global solutions in e-commerce and marketplace. Collaborate with cross-functional teams and leverage AI for operational efficiency.
Intern - Digital Automation and Solutions Team
Micron Technology
Join Micron's Digital Automation Solutions Team as an intern, focusing on robotics systems integration and operational visibility. Gain hands-on experience and develop practical skills in a live semiconductor manufacturing environment.
Digital Integrated Circuit (IC) Engineer – UNSW School of Biomedical Engineering
UNSW
Join UNSW as a Digital Integrated Circuit Engineer, contributing to the development of CMOS bioelectronic circuits. Collaborate with experts in biomedical microelectronics and neural interface technologies in a dynamic research environment.
Digital Process Engineer
Built
Join Built as a Digital Process Engineer to improve project delivery through digital workflows and systems. Collaborate with teams to enhance efficiency and drive innovation in construction.
Research Fellow (Semiconductor Advanced Packaging)
Nanyang Technological University
Join Nanyang Technological University as a Research Fellow to advance low-temperature Cu/dielectric hybrid bonding for high-density interconnects, focusing on materials selection and process development.
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